JPH0356053Y2 - - Google Patents

Info

Publication number
JPH0356053Y2
JPH0356053Y2 JP1984102593U JP10259384U JPH0356053Y2 JP H0356053 Y2 JPH0356053 Y2 JP H0356053Y2 JP 1984102593 U JP1984102593 U JP 1984102593U JP 10259384 U JP10259384 U JP 10259384U JP H0356053 Y2 JPH0356053 Y2 JP H0356053Y2
Authority
JP
Japan
Prior art keywords
tape
hole
semiconductor device
semiconductor
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984102593U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6117751U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984102593U priority Critical patent/JPS6117751U/ja
Publication of JPS6117751U publication Critical patent/JPS6117751U/ja
Application granted granted Critical
Publication of JPH0356053Y2 publication Critical patent/JPH0356053Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1984102593U 1984-07-05 1984-07-05 テ−プキヤリア半導体装置 Granted JPS6117751U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984102593U JPS6117751U (ja) 1984-07-05 1984-07-05 テ−プキヤリア半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984102593U JPS6117751U (ja) 1984-07-05 1984-07-05 テ−プキヤリア半導体装置

Publications (2)

Publication Number Publication Date
JPS6117751U JPS6117751U (ja) 1986-02-01
JPH0356053Y2 true JPH0356053Y2 (en]) 1991-12-16

Family

ID=30661988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984102593U Granted JPS6117751U (ja) 1984-07-05 1984-07-05 テ−プキヤリア半導体装置

Country Status (1)

Country Link
JP (1) JPS6117751U (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750724B2 (ja) * 1986-12-17 1995-05-31 株式会社日立製作所 液晶表示装置
JPH0691131B2 (ja) * 1988-11-30 1994-11-14 松下電器産業株式会社 フィルムキャリァ
JP2006210478A (ja) * 2005-01-26 2006-08-10 Renesas Technology Corp 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834952A (ja) * 1981-08-26 1983-03-01 Nec Corp 半導体装置用テ−プキヤリア

Also Published As

Publication number Publication date
JPS6117751U (ja) 1986-02-01

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